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ASIC Packaging

Swindon offers, through our world renowned packaging partners a broad range of standard and custom Leadframe, Leadless and Laminate packages with pin counts ranging from 3 to 484+. Also offered are WLCSPs or Wafer-Level Chip-Scale Packages which is a low cost solution that enables direct connectivity at the substrate or board level.

Below are some examples of the packages that we currently use today. There are however many other types of packages such as SSOP and SOIC that we also utilise.

System in Package

Body Size (mm)Pin Counts
2.5x312
2.5x313
3x517
3x518
5x319
3x520
5x521
3x522
4x426

QFN

Body Size (mm)QFN pin counts
0.8, 0.65, 0.5, 0.4, 0.35, 0.3 mm pitch
2 x 26/8/10/12
3x34/8/10/12/16/20/24
4x412/16/20/24/28/32/40
5x516/20/28/32/36/40/44/52
6x518/24/36/42
6x620/24/28/36/40/48/56/64
7x728/32/36/44/48/56/68/80
8x832/36/40/52/56/68/76/88
9x936/44/48/60/64/76/88/104
10x1044/52/56/68/72/88/100/116
12x1248/60/84/88/100/108/124/144

Wafer Level Chip Scale Packaging (WLCSP)

Swindon offers, through our world renowned packaging partners, a Wafer Level CSP low cost solution that enables direct connectivity at the substrate or board level. Our partners who provide this service are equipped with latest state-of-the art Laser Mark, Laser Groove, Wafer 2D/3D inspection station and high speed Die Sorters.

Swindon offers full turnkey solution for Wafer Level CSP which includes wafer test (probing), wafer bumping and tape and reel utilizing full wafer map integration to handle die sizes from 0.2 sq.mm to 36 sq.mm.

Body Size (mm)QFN pin counts
0.8, 0.65, 0.5, 0.4, 0.35, 0.3 mm pitch
2 x 26/8/10/12
3x34/8/10/12/16/20/24
4x412/16/20/24/28/32/40
5x516/20/28/32/36/40/44/52
6x518/24/36/42
6x620/24/28/36/40/48/56/64
7x728/32/36/44/48/56/68/80
8x832/36/40/52/56/68/76/88
9x936/44/48/60/64/76/88/104
10x1044/52/56/68/72/88/100/116
12x1248/60/84/88/100/108/124/144

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