ASIC Production Test

At Swindon the production test of the ASIC is a key component of what we do and is an important element in the process of providing high quality product that is reliable and free of defects. It is so important and critical to the quality of what we produce that we conduct all wafer probe and ATE in-house at our Swindon facility.

• Fully automated wafer and package level test
• Fully automated, online test and QA procedures
• 100% wafer level test
• 100% package level test
• Real-time yield statistics
• Wafer and package level tests correlated
• 100% Data log
• Tri temperature test
• Burn In

The Swindon Test Engineering Departments provides our customers with a wide range of experience in the ASIC test environment which includes RF, mixed signal and digital coupled with pressure calibration over temperature.

Their primary aim is to ensure 100% on time delivery with high yield and industry leading low ppm failure rates by developing test software and hardware to facilitate medium to high volume production. Our engineers develop complex production test programs for optimum throughput to maximise coverage but at the same time keeping the test program to a minimum, in order to reduce the test cost per IC.

Yield analysis is a constant factor and yield improvement initiatives are conducted at all times to maintain the quality of the product that we deliver to our customers and provide sub 1PPM field failure rates.

As one of many continual improvements, we have reduced the test time of Devices Under Test (DUT) but also increased test coverage. This in turn minimises the final device cost but maximises performance through quality. The result is a dramatic increase in product repeatability, yield and overall test quality with a vast decrease in field failure ppm rates.

We also specialise in the test and production of MEMS which are integrated with the ASIC into a single System in Package (SiP), which we are then pressure calibrated over temperature.